1

layer

1-18 layer

2

Material

FR-4,CEM-1,CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2

3

Board thickness

0.2mm-4mm

4

Max.finished board side

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish/treatment

HASL/HASL lead free,Chemical tin,Chemical Gold,

Immersion gold Immersion Silver/Gold,Osp,Gold Plating

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,CQC

15

profiling punching

Routing,V-CUT,Beveling

16. providing OEM service to all sorts of printed circuit board assembly